Profile
MEMBERSHIP
Membership in the Malaysian Tin Products Manufacturers’ Association (MPTMA), comprising ordinary and associate members, currently stood at 12.
REGISTRATION
The Association was officially registered on 15th February 1990 with the Registrar of Societies under the Societies Act 1966.
PRESIDENT AND OFFICE BEARERS
The following Association members were duly elected / re-elected as office-bearers of the Association for 2025 / 2026 term at the Association’s 35th AGM held on 19th June 2025 :-
PRESIDENT
MR. DAVID TAN TAI WUI
Tumasek Pewter Sdn Bhd
VICE PRESIDENT
MR. PAVITHIRAN NARAYANAN
Nihon Superior (M) Sdn Bhd
HON. SECRETARY
MR. TAN CHUN HEONG
RedRing Solder (M) Sdn Bhd
HON. TREASURER
MR. CHEN TIEN YUE
Royal Selangor International Sdn Bhd
MANAGEMENT COMMITTEE
The following were elected / re-elected to the Management Committee for 2025 / 2026 term :-
CHAIRMAN
MR. LIM CHENG SANG
Selayang Metal Industries Sdn Bhd
MR. DAVID TAN TAI WUI
Tumasek Pewter Sdn Bhd
MR. TAN CHUN HEONG
RedRing Solder (M) Sdn Bhd
MR. CHEN TIEN YUE
Royal Selangor International Sdn Bhd
Alternate – Ms Keong Joo Dee
EN. ROSLI JALIL
Perusahaan Sadur Timah Malaysia Sdn Bhd (PERSTIMA)
Alternate – Pn. Mazlina Abu Bakar
MR. PAVITHIRAN NARAYANAN
Nihon Superior (M) Sdn Bhd
MR. YEW WEI AUN
Selayang Solder Sdn Bhd
To assist the Management Committee in undertaking its duties and responsibilities effectively, two sub-committees have been formed, which are as follows;
SOLDER SUB COMMITTEE
CONVENOR
MR. LIM CHENG SANG
COMMITTEE MEMBERS
MR. YEW WEI AUN
TN. HAJI MUHAMAD NOR MUHAMAD
MR. PAVITHIRAN NARAYANAN
MR. TAN CHUN HEONG
EN. CHE AHMAD KAMEROL HISHAM ABD RAHMAN
The Sub-Committee on Solder was formed in 1993. Its members comprise representatives of the major solder manufacturing companies in Malaysia.
The primary objective of this Sub-Committee is to provide a forum for deliberating matters of common interests of solder company members of the Association. In addition, it considers views and proposals on issues affecting the tin solder sub-sector, and where appropriate, raises them with the Management Committee of the Association for endorsement and for subsequent submission to the relevant authorities, if necessary.
Matters of importance which the Sub-Committee continued to deliberate upon are solder market conditions, sales trend, marketing, pricing, employment, environmental, social and governance (ESG) . Members of the Sub-Committee have continued to cooperate, engage and network with each other in ensuring fair competition and trade in the local solder market.
NEWSLETTER EDITORIAL SUB COMMITTEE
CHAIRMAN
MR. LIM CHENG SANG
COMMITTEE MEMBERS
MR. TAN CHUN HEONG
MR. CHEN TIEN YUE
MR. YEW WEI AUN
MR. PAVITHIRAN NARAYANAN
EN. ROSLI JALIL
MR. DAVID TAN TAI WUI
TN. HAJI MUHAMAD NOR MUHAMAD
EN. CHE AHMAD KAMEROL HISHAM ABD RAHMAN
The Newsletter Editorial Sub-Committee is responsible for overseeing the publication of the Association’s official Newsletter. It also ensures that the Newsletter’s four quarterly issues are published appropriately each year. The Newsletter called the “Malaysian Tin Products” has a circulation of 250 copies per issue.
Further details of the Newsletter can be found under the “Publications” page
MEMBERSHIP SUBSCRIPTION
The entrance fee and annual subscription of members of the Associations are as follows:-
ORDINARY MEMBER
Entrance fee – RM100
Annual Subscription – RM200 per annum
ASSOCIATE MEMBER
Entrance Fee – RM100
Annual Subscription – RM200 per annum
Entrance fee and annual subscription are payable in advance at the time of application for membership, and thereafter the annual subscription is payable on 1st January of each year.